Panasonic Network Card 2SC3931 User Manual

This product complies with the RoHS Directive (EU 2002/95/EC).  
Transistors  
2SC3931  
Silicon NPN epitaxial planar type  
For high-frequency amplification  
Unit: mm  
+0.10  
+0.1  
–0.0  
0.15  
0.3  
–0.05  
3
Features  
Optimum for RF amplification of FM/AM radios  
High transition frequency fT  
S-Mini type package, allowing downsizing of the equipment and  
automatic insertion through the tape packing  
1
2
(0.65) (0.65)  
1.3 0.1  
2.0 0.2  
Absolute Maximum Ratings Ta = 25°C  
10˚  
Parameter  
Symbol  
Rating  
Unit  
V
Collector-base voltage (Emitter open) VCBO  
Collector-emitter voltage (Base open) VCEO  
Emitter-base voltage (Collector open) VEBO  
30  
1: Base  
2: Emitter  
3:Collector  
20  
V
3
15  
V
EIAJ: SC-70  
SMini3-G1 Package  
Collector current  
IC  
PC  
Tj  
mA  
mW  
°C  
°C  
Collector power dissipation  
Junction temperature  
Storage temperature  
150  
Marking Symbol: U  
150  
Tstg  
55 to +150  
Electrical Characteristics Ta = 25°C 3°C  
Parameter  
Symbol  
VCBO  
VEBO  
VBE  
Conditions  
Min  
30  
3
Typ  
Max  
Unit  
V
Collector-base voltage (Emitter open)  
Emitter-base voltage (Collector open)  
Base-emitter voltage  
IC = 10 µA, IE = 0  
IE = 10 µA, IC = 0  
V
VCB = 6 V, IE = −1 mA  
720  
mV  
Forward current transfer ratio *  
Transition frequency  
hFE  
VCB = 6 V, IE = −1 mA  
65  
260  
1.0  
fT  
VCB = 6 V, IE = −1 mA, f = 200 MHz  
VCB = 6 V, IE = −1 mA, f = 10.7 MHz  
450  
650  
0.8  
MHz  
pF  
Common-emitter reverse transfer  
capacitance  
Cre  
Power gain  
GP  
VCB = 6 V, IE = −1 mA, f = 100 MHz  
24  
dB  
dB  
Noise figure  
NF  
VCB = 6 V, IE = −1 mA, f = 100 MHz  
3.3  
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.  
2. : Rank classification  
*
Rank  
C
D
hFE  
65 to 160  
100 to 260  
Publication date: March 2003  
SJC00142BED  
1
 
This product complies with the RoHS Directive (EU 2002/95/EC).  
2SC3931  
Cob VCB  
GP IE  
NF IE  
40  
30  
20  
10  
0
12  
10  
8
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0
f = 100 MHz  
Rg = 50 kΩ  
Ta = 25°C  
IE = 0  
f = 100 MHz  
Rg = 50 Ω  
Ta = 25°C  
f = 1 MHz  
Ta = 25°C  
VCE = 10 V  
6 V  
6
VCE = 6 V, 10 V  
4
2
0
0.1  
1  
10  
100  
0.1  
1  
10  
100  
0
5
10  
15  
20  
25  
30  
(
)
(
)
(
)
V
Emitter current IE mA  
Emitter current IE mA  
Collector-base voltage VCB  
bie gie  
bre gre  
bfe gfe  
0
1  
2  
3  
4  
5  
6  
0
20  
20  
16  
12  
8
yie = gie + jbie  
10.7  
25  
150  
yre = gre + jbre  
10.7  
VCE = 10 V  
4 mA  
VCE = 10 V  
58  
1 mA  
100  
100  
150  
2 mA  
7 mA  
4 mA  
1 mA  
2 mA  
100  
58  
40  
4 mA  
150  
58  
100  
58  
IE = −7 mA  
60  
f = 150 MHz  
IE = −7 mA  
100  
58  
80  
100  
25  
4
25  
100  
120  
yfe = gfe + jbfe  
VCE = 10 V  
f = 150 MHz  
f = 10.7 MHz  
0
0.5 0.4 0.3 0.2 0.1  
0
0
20  
40  
60  
80  
100  
0
3
6
9
12  
15  
(
)
(
)
(
)
Reverse transfer conductance gre mS  
Forward transfer conductance gfe mS  
Input conductance gie mS  
boe goe  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0
150  
2 mA  
4 mA  
100  
7 mA  
58  
25  
yoe = goe + jboe  
VCE = 10 V  
f = 10.7 MHz  
0
0.1  
0.2  
0.3  
0.4  
0.5  
(
)
Output conductance goe mS  
SJC00142BED  
3
 
Request for your special attention and precautions in using the technical information and  
semiconductors described in this book  
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and  
regulations of the exporting country, especially, those with regard to security export control, must be observed.  
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples  
of the products, and no license is granted under any intellectual property right or other right owned by our company or any other  
company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other  
company which may arise as a result of the use of technical information described in this book.  
(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office  
equipment, communications equipment, measuring instruments and household appliances).  
Consult our sales staff in advance for information on the following applications:  
Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support  
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod-  
ucts may directly jeopardize life or harm the human body.  
Any applications other than the standard applications intended.  
(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-  
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product  
Standards in advance to make sure that the latest specifications satisfy your requirements.  
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions  
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute  
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any  
defect which may arise later in your equipment.  
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure  
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire  
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.  
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,  
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which  
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.  
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita  
Electric Industrial Co., Ltd.  
 

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