Philips Car Amplifier TDA1510AQ User Manual

INTEGRATED CIRCUITS  
DATA SHEET  
TDA1510AQ  
24 W BTL or 2 x 12 W stereo car  
radio power amplifier  
January 1992  
Product specification  
File under Integrated Circuits, IC01  
 
Philips Semiconductors  
Product specification  
24 W BTL or 2 x 12 W stereo car radio  
power amplifier  
TDA1510AQ  
Fig.1 Functional diagram; heavy lines indicate signal paths.  
January 1992  
3
 
Philips Semiconductors  
Product specification  
24 W BTL or 2 x 12 W stereo car radio  
power amplifier  
TDA1510AQ  
RATINGS  
Limiting values in accordance with the Absolute Maximum System (IEC 134)  
PARAMETER  
CONDITIONS  
SYMBOL  
MIN.  
MAX.  
UNIT  
Supply voltage:  
operating  
pin 10  
V
V
18  
V
V
P
P
non-operating  
28  
non-operating,  
load dump protection  
Peak output current  
Total power dissipation  
Storage temperature range  
Crystal temperature  
during 50 ms  
see Fig.2  
V
I
45  
6
V
A
P
OM  
P
tot  
stg  
c
T
T
65  
+ 150  
+150  
°C  
°C  
Fig.2 Power derating curves.  
January 1992  
4
 
Philips Semiconductors  
Product specification  
24 W BTL or 2 x 12 W stereo car radio  
power amplifier  
TDA1510AQ  
HEATSINK DESIGN EXAMPLE  
The derating of the encapsulation requires the following external heatsink (for sine-wave drive):  
(R  
) = 3,5 K/W  
th j-mb  
24 W BTL (4 ) or 2 × 12 W stereo (2 ); maximum sine-wave dissipation = 12 W;  
T
= 65 °C (maximum):  
amb  
150 65  
Rth h-a  
=
3,5 = 3,5 K/W  
----------------------  
12  
2 × 7 W stereo (4 ); maximum sine-wave dissipation = 6 W; T  
= 65 °C (maximum):  
amb  
150 65  
Rth h-a  
=
3,5 = 10,5 K/W  
----------------------  
12  
D.C. CHARACTERISTICS  
PARAMETER  
CONDITIONS  
SYMBOL  
MIN.  
6,0  
TYP.  
14,4  
MAX.  
18,0  
UNIT  
Supply voltage range  
Repetitive peak output current  
Total quiescent current  
Stand-by current  
V
I
V
A
P
0,15  
75  
4,0  
120  
2
ORM  
tot  
I
I
I
mA  
mA  
mA  
sb  
Switch-on current  
V
V ; note 1  
0,35  
0,80  
11  
10  
so  
January 1992  
5
 
Philips Semiconductors  
Product specification  
24 W BTL or 2 x 12 W stereo car radio  
power amplifier  
TDA1510AQ  
A.C. CHARACTERISTICS  
T
= 25 °C; V = 14,4 V; f = 1 kHz; unless otherwise specified  
amb  
P
PARAMETER  
CONDITIONS  
SYMBOL  
MIN.  
TYP.  
MAX.  
UNIT  
Bridge Tied Load application (BTL)  
Output power  
with bootstrap  
note 6;  
R = 4 Ω  
L
V = 13,2 V  
P
d
d
= 0,5%  
= 10%  
P
15,0  
W
tot  
tot  
o
P
20,0  
W
o
V = 14,4 V  
P
d
d
= 0,5%  
= 10%  
P
15,5  
20,0  
39,5  
18,0  
24,0  
75  
40,5  
W
tot  
tot  
o
P
W
o
Open loop voltage gain  
Closed loop voltage gain  
Frequency response  
Input impedance  
G
dB  
dB  
Hz  
MΩ  
o
note 2  
G
40,0  
c
at 3 dB; note 3  
note 4  
f
20 to > 20 k −  
r
|Z |  
1
i
Noise output voltage  
(r.m.s. value)  
f = 20 Hz to  
20 kHz  
R = 0 Ω  
V
0,2  
0,8  
mV  
mV  
S
n (rms)  
R = 10 Ω  
V
0,35  
S
n (rms)  
R = 10 k;  
S
according to  
IEC 179 curve A  
f = 100 Hz; note 5  
V
42  
0,25  
50  
2
mV  
dB  
n (rms)  
Supply voltage ripple rejection  
SVRR  
D.C. output offset voltage between  
channels  
|V  
|
50  
mV  
5-9  
Power bandwidth  
1 dB;  
d
= 0,5%  
B
30 to > 40 k −  
Hz  
tot  
January 1992  
6
 
Philips Semiconductors  
Product specification  
24 W BTL or 2 x 12 W stereo car radio  
power amplifier  
TDA1510AQ  
PARAMETER  
Stereo application  
CONDITIONS  
SYMBOL  
MIN.  
TYP.  
MAX.  
UNIT  
Output power; with bootstrap  
note 6;  
R = 4 Ω  
L
V = 13,2 V  
P
d
d
= 0,5%  
= 10%  
P
4,5  
6,0  
W
tot  
tot  
o
P
W
o
V = 14,4 V  
P
d
d
= 0,5%  
= 10%  
P
4,5  
6,0  
5,5  
7,0  
W
W
tot  
tot  
o
P
o
R = 2 Ω  
L
V = 13,2 V  
P
d
d
= 0,5%  
= 10%  
P
7,5  
W
W
tot  
tot  
o
P
10,0  
o
V = 14,4 V  
P
d
d
= 0,5%  
= 10%  
P
7,75  
10,0  
9,0  
W
W
tot  
tot  
o
P
12,0  
o
Output power; without bootstrap  
notes 6, 8 and 9  
R = 4 Ω  
L
V = 14,4 V  
P
d
= 10%  
P
6
W
tot  
o
Frequency response  
notes 3 and 6  
3 dB  
f
40 to > 20 k −  
Hz  
dB  
r
Supply voltage ripple rejection  
Channel separation  
note 5  
f = 1 kHz  
SVRR  
50  
R = 10 k;  
S
f = 1 kHz  
note 7  
α
G
40  
50  
40,5  
dB  
dB  
Closed loop voltage gain  
Noise output voltage  
(r.m.s. value)  
39,5  
40,0  
c
f = 20 Hz to 20 kHz;  
R = 0 Ω  
V
0,15  
0,25  
mV  
mV  
S
n (rms)  
n (rms)  
R = 10 kΩ  
V
S
R = 10 k;  
S
according to  
IEC179 curve A  
V
0,2  
mV  
n (rms)  
January 1992  
7
 
Philips Semiconductors  
Product specification  
24 W BTL or 2 x 12 W stereo car radio  
power amplifier  
TDA1510AQ  
Notes to the characteristics  
1. If V > V then I must be < 10 mA.  
11  
10  
11  
2. Closed loop voltage gain can be chosen between 32 and 56 dB (BTL), and is determined by external components.  
3. Frequency response externally fixed.  
4. The input impedance in the test circuit (Fig.3) is typ. 100 k.  
5. Supply voltage ripple rejection measured with a source impedance of 0 (maximum ripple amplitude 2 V).  
6. Output power is measured directly at the output pins of the IC.  
7. Closed loop voltage gain can be chosen between 26 and 50 dB (stereo), and is determined by external components.  
8. A resistor of 56 kbetween pins 3 and 7 is required for symmetrical clipping.  
9. Without bootstrap the 100 µF capacitor between pins 5 and 6 and the 100 µF capacitor between pins 8 and 9 can  
be omitted. Pins 6 and 8 connected to pin 10.  
January 1992  
8
 
Philips Semiconductors  
Product specification  
24 W BTL or 2 x 12 W stereo car radio  
power amplifier  
TDA1510AQ  
APPLICATION INFORMATION  
(1) belongs to power supply.  
Fig.3 Test and application circuit; Bridge Tied Load (BTL).  
(1) belongs to power supply.  
Fig.4 Test and application circuit; stereo mode.  
9
January 1992  
 
Philips Semiconductors  
Product specification  
24 W BTL or 2 x 12 W stereo car radio  
power amplifier  
TDA1510AQ  
PACKAGE OUTLINE  
DBS13P: plastic DIL-bent-SIL power package; 13 leads (lead length 12 mm)  
SOT141-6  
non-concave  
x
D
h
D
E
h
view B: mounting base side  
d
A
2
B
j
E
A
L
3
L
Q
c
2
v
M
1
13  
e
e
m
w
M
1
Z
b
p
e
0
5
10 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
(1)  
(1)  
(1)  
UNIT  
A
A
b
c
D
d
D
E
e
e
e
E
j
L
L
3
m
Q
v
w
x
Z
2
p
h
1
2
h
17.0 4.6 0.75 0.48 24.0 20.0  
15.5 4.2 0.60 0.38 23.6 19.6  
12.2  
11.8  
3.4 12.4 2.4  
3.1 11.0 1.6  
2.00  
1.45  
2.1  
1.8  
6
mm  
10  
3.4  
1.7 5.08  
0.8  
4.3  
0.25 0.03  
Note  
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
EIAJ  
95-03-11  
97-12-16  
SOT141-6  
January 1992  
10  
 
Philips Semiconductors  
Product specification  
24 W BTL or 2 x 12 W stereo car radio  
power amplifier  
TDA1510AQ  
The device may be mounted up to the seating plane, but  
the temperature of the plastic body must not exceed the  
SOLDERING  
Introduction  
specified maximum storage temperature (T  
). If the  
stg max  
printed-circuit board has been pre-heated, forced cooling  
may be necessary immediately after soldering to keep the  
temperature within the permissible limit.  
There is no soldering method that is ideal for all IC  
packages. Wave soldering is often preferred when  
through-hole and surface mounted components are mixed  
on one printed-circuit board. However, wave soldering is  
not always suitable for surface mounted ICs, or for  
printed-circuits with high population densities. In these  
situations reflow soldering is often used.  
Repairing soldered joints  
Apply a low voltage soldering iron (less than 24 V) to the  
lead(s) of the package, below the seating plane or not  
more than 2 mm above it. If the temperature of the  
soldering iron bit is less than 300 °C it may remain in  
contact for up to 10 seconds. If the bit temperature is  
between 300 and 400 °C, contact may be up to 5 seconds.  
This text gives a very brief insight to a complex technology.  
A more in-depth account of soldering ICs can be found in  
our “IC Package Databook” (order code 9398 652 90011).  
Soldering by dipping or by wave  
The maximum permissible temperature of the solder is  
260 °C; solder at this temperature must not be in contact  
with the joint for more than 5 seconds. The total contact  
time of successive solder waves must not exceed  
5 seconds.  
DEFINITIONS  
Data sheet status  
Objective specification  
Preliminary specification  
Product specification  
This data sheet contains target or goal specifications for product development.  
This data sheet contains preliminary data; supplementary data may be published later.  
This data sheet contains final product specifications.  
Limiting values  
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or  
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation  
of the device at these or at any other conditions above those given in the Characteristics sections of the specification  
is not implied. Exposure to limiting values for extended periods may affect device reliability.  
Application information  
Where application information is given, it is advisory and does not form part of the specification.  
LIFE SUPPORT APPLICATIONS  
These products are not designed for use in life support appliances, devices, or systems where malfunction of these  
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for  
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such  
improper use or sale.  
January 1992  
11  
 

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