INTEGRATED CIRCUITS
DATA SHEET
TDA5051A
Home automation modem
1999 May 31
Product specification
Supersedes data of 1997 Sep 19
File under Integrated Circuits, IC11
Philips Semiconductors
Product specification
Home automation modem
TDA5051A
ORDERING INFORMATION
TYPE
PACKAGE
NUMBER
NAME
DESCRIPTION
VERSION
TDA5051AT
SO16
plastic small outline package; 16 leads; body width 7.5 mm
SOT162-1
BLOCK DIAGRAM
DGND
AGND
12
V
V
V
DDA
13
DDD
3
DDAP
11
5
modulated
carrier
POWER
DRIVE
WITH
6
10
TX
ROM
D/A
OUT
PROTECTION
9
DAC clock
APGND
10
1
4
CONTROL LOGIC
DATA
IN
TDA5051A
15
PD
filter clock
CLK
OUT
7
8
OSC1
OSC2
OSCILLATOR
2
÷
DIGITAL
BAND-PASS
FILTER
14
2
DIGITAL
DEMODULATOR
RX
IN
DATA
OUT
A/D
8
5
H
L
U
D
PEAK
DETECT
U/D
COUNT
16
6
MGK832
TEST1 SCANTEST
Fig.1 Block diagram.
3
1999 May 31
Philips Semiconductors
Product specification
Home automation modem
TDA5051A
PINNING
SYMBOL PIN
DESCRIPTION
DATAIN
DATAOUT
VDDD
1
2
3
4
5
6
7
8
9
digital data input (active LOW)
digital data output (active LOW)
digital supply voltage
clock output
handbook, halfpage
DATA
1
2
3
4
5
6
7
8
16
TEST1
PD
IN
CLKOUT
DGND
DATA
15
14
13
12
11
10
9
OUT
DDD
OUT
digital ground
V
RX
IN
SCANTEST
OSC1
test input (LOW in application)
oscillator input
CLK
V
DDA
TDA5051AT
DGND
SCANTEST
OSC1
OSC2
oscillator output
AGND
APGND
TXOUT
analog ground for power amplifier
V
DDAP
10 analog signal output
TX
OUT
VDDAP
11 analog supply voltage for power
amplifier
APGND
OSC2
MGK833
AGND
VDDA
RXIN
12 analog ground
13 analog supply voltage
14 analog signal input
PD
15 power-down input (active HIGH)
16 test input (HIGH in application)
Fig.2 Pin configuration.
TEST1
All logic inputs and outputs are compatible with
TTL/CMOS levels, providing an easy connection to a
standard microcontroller I/O port.
FUNCTIONAL DESCRIPTION
Both transmission and reception stages are controlled
either by the master clock of the microcontroller or by the
on-chip reference oscillator connected to a crystal. This
ensures the accuracy of the transmission carrier and the
exact trimming of the digital filter, thus making the
performance totally independent of application
disturbances such as component spread, temperature,
supply drift and so on.
The digital part of the IC is fully scan-testable. Two digital
inputs, SCANTEST and TEST1, are used for production
test: these pins must be left open-circuit in functional mode
(correct levels are internally defined by pull-up or
pull-down resistors).
Transmission mode
The interface with the power network is made by means of
an LC network (see Fig.18). The device includes a power
output stage that feeds a 120 dBµV (RMS) signal on a
typical 30 Ω load.
To provide strict stability with respect to environmental
conditions, the carrier frequency is generated by scanning
the ROM memory under the control of the microcontroller
clock or the reference frequency provided by the on-chip
oscillator. High frequency clocking rejects the aliasing
components to such an extent that they are filtered by the
coupling LC network and do not cause any significant
disturbance. The data modulation is applied through
pin DATAIN and smoothly applied by specific digital circuits
to the carrier (shaping). Harmonic components are limited
in this process, thus avoiding unacceptable disturbance of
the transmission channel (according to CISPR16 and
EN50065-1 recommendations). A −55 dB Total Harmonic
Distortion (TDH) is reached when the typical LC coupling
network (or an equivalent filter) is used.
To reduce power consumption, the IC is disabled by a
power-down input (pin PD): in this mode, the on-chip
oscillator remains active and the clock continues to be
supplied at pin CLKOUT. For low-power operation in
reception mode, this pin can be dynamically controlled by
the microcontroller, see Section “Power-down mode”.
When the circuit is connected to an external clock
generator (see Fig.6), the clock signal must be applied at
pin OSC1 (pin 7); OSC2 (pin 8) must be left open-circuit.
Fig.7 shows the use of the on-chip clock circuit.
1999 May 31
4
Philips Semiconductors
Product specification
Home automation modem
TDA5051A
The DAC and the power stage are set in order to provide
a maximum signal level of 122 dBµV (RMS) at the output.
After digital demodulation, the baseband data signal is
made available after pulse shaping.
The output of the power stage (TXOUT) must always be
connected to a decoupling capacitor, because of a DC
level of 0.5VDD at this pin, which is present even when the
device is not transmitting. This pin must also be protected
against overvoltage and negative transient signals.
The DC level of TXOUT can be used to bias a unipolar
transient suppressor, as shown in the application diagram;
see Fig.18.
The signal pin (RXIN) is a high-impedance input which has
to be protected and DC decoupled for the same reasons
as with pin TXOUT. The high sensitivity (82 dBµV) of this
input requires an efficient 50 Hz rejection filter (realized by
the LC coupling network), which also acts as an
anti-aliasing filter for the internal digital processing;
see Fig.18.
Data format
Direct connection to the mains is done through an LC
network for low-cost applications. However, a HF signal
transformer could be used when power-line insulation has
to be performed.
TRANSMISSION MODE
The data input (DATAIN) is active LOW: this means that a
burst is generated on the line (pin TXOUT) when DATAIN
pin is LOW.
CAUTION
Pin TXOUT is in a high-impedance state as long as the
device is not transmitting. Successive logic 1s are treated
in a Non-Return-to-Zero (NRZ) mode, see pulse shapes in
Figs 8 and 9.
In transmission mode, the receiving part of the circuit is
not disabled and the detection of the transmitted signal
is normally performed. In this mode, the gain chosen
before the beginning of the transmission is stored, and
the AGC is internally set to −6 dB as long as DATAIN
is LOW. Then, the old gain setting is automatically
restored.
RECEPTION MODE
The data output (pin DATAOUT) is active LOW; this means
that the data output is LOW when a burst is received.
Pin DATAOUT remains LOW as long as a burst is received.
Reception mode
The input signal received by the modem is applied to a
wide range input amplifier with AGC (−6 to +30 dB). This is
basically for noise performance improvement and signal
level adjustment, which ensures a maximum sensitivity of
the ADC. An 8-bit conversion is then performed, followed
by digital band-pass filtering, to meet the CISPR
normalization and to comply with some additional
limitations met in current applications.
Power-down mode
Power-down input (pin PD) is active HIGH; this means that
the power consumption is minimum when pin PD is HIGH.
Now, all functions are disabled, except clock generation.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER
VDD
MIN.
MAX.
UNIT
supply voltage
4.5
5.5
12
V
fosc
Tstg
Tamb
Tj
oscillator frequency
storage temperature
ambient temperature
junction temperature
−
MHz
°C
−50
−10
−
+150
+80
°C
°C
125
HANDLING
Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is
desirable to take normal precautions appropriate to handling MOS devices.
1999 May 31
5
Philips Semiconductors
Product specification
Home automation modem
TDA5051A
CHARACTERISTICS
VDDD = VDDA = 5 V ±5%; Tamb = 0 to 70 °C; VDDD connected to VDDA; DGND connected to AGND.
SYMBOL PARAMETER CONDITIONS MIN. TYP.
MAX.
UNIT
Supply
VDD
supply voltage
4.75
5
5.25
V
IDD(RX/TX)(tot) total analog + digital
supply current
VDD = 5 V ±5%
TX or RX mode
−
28
38
mA
IDD(PD)(tot)
total analog + digital
supply current;
VDD = 5 V ±5%;
PD = HIGH
−
19
25
mA
Power-down mode
IDD(PAMP)
power amplifier supply
current
VDD = 5 V ±5%;
ZL = 30 Ω;
DATAIN = LOW
in transmission mode
−
−
19
76
30
mA
mA
IDD(PAMP)(max) maximum power amplifier VDD = 5 V ±5%;
−
supply current
ZL = 1 Ω;
DATAIN = LOW
in transmission mode
DATAIN and PD inputs: DATAOUT and CLKOUT outputs
VIH
VIL
HIGH-level input voltage
0.2VDD + 0.9 −
VDD + 0.5
V
LOW-level input voltage
−0.5
2.4
−
−
−
−
0.2VDD − 0.1 V
−
VOH
VOL
HIGH-level output voltage IOH = −1.6 mA
LOW-level output voltage
V
V
IOL = 1.6 mA
0.45
OSC1 input and OSC2 output (OSC2 only used for driving external quartz crystal; must be left open-circuit
when using an external clock generator)
VIH
VIL
HIGH-level input voltage
0.7VDD
−0.5
2.4
−
−
−
−
VDD + 0.5
V
LOW-level input voltage
0.2VDD − 0.1 V
−
VOH
VOL
HIGH-level output voltage IOH = −1.6 mA
LOW-level output voltage
V
V
IOL = 1.6 mA
−
0.45
Clock
fosc
oscillator frequency
6.080
−
9.504
MHz
ratio between oscillator
and carrier frequency
−
64
−
fosc
--------
fcr
ratio between oscillator
and clock output frequency
−
2
−
f osc
---------------------
fCLKOUT
Transmission mode
fcr
carrier frequency
fosc = 8.48 MHz
−
−
132.5
170
−
−
kHz
tsu
set-up time of the shaped fosc = 8.48 MHz;
burst
µs
see Fig.8
th
hold time of the shaped
burst
fosc = 8.48 MHz;
see Fig.8
−
170
−
µs
1999 May 31
6
Philips Semiconductors
Product specification
Home automation modem
TDA5051A
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
190
MAX.
UNIT
µs
tW(DI)(min)
minimum pulse width of
DATAIN signal
fosc = 8.48 MHz;
see Fig.8
−
−
Vo(rms)
Io(max)
Zo
output carrier signal
(RMS value)
ZL = CISPR16;
DATAIN = LOW
120
−
−
122
−
dBµV
mA
Ω
power amplifier maximum ZL = 1 Ω;
output current (peak value) DATAIN = LOW
160
5
output impedance of the
power amplifier
−
−
VO
output DC level at
pin TXOUT
−
2.5
−55
−
V
THD
total harmonic distortion on
CISPR16 load with the
coupling network
V
o(rms) = 121 dBµV on
CISPR16 load;
osc = 8.48 MHz;
−
−
dB
f
(measured on the first ten DATAIN = LOW
harmonics)
(no modulation);
see Figs 3 and 16
B−20dB
bandwidth of the shaped
output signal (at −20 dB)
on CISPR16 load with the
coupling network
Vo(rms) = 121 dBµV on
−
3000
−
Hz
CISPR16 load;
f
osc = 8.48 MHz;
DATAIN = 300 Hz;
duty factor = 50%;
see Fig.4
Reception mode
Vi(rms)
analog input signal
(RMS value)
82
−
122
dBµV
VI
DC level at pin RXIN
RXIN input impedance
AGC range
−
−
−
−
2.5
50
−
−
−
−
V
Zi
kΩ
dB
µs
RAGC
tc(AGC)
36
AGC time constant
fosc = 8.48 MHz;
see Fig.5
296
td(dem)(su)
td(dem)(h)
demodulation delay set-up fosc = 8.48 MHz;
−
−
350
420
400
470
µs
time
see Fig.15
demodulation delay hold
time
fosc = 8.48 MHz;
see Fig.15
µs
Bdet
detection bandwidth
bit error rate
fosc = 8.48 MHz
−
−
3
1
−
−
kHz
1 × 10−4
BER
fosc = 8.48 MHz;
600 baud; S/N = 35 dB;
signal 76 dBµV;
see Fig.17
1999 May 31
7
Philips Semiconductors
Product specification
Home automation modem
TDA5051A
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Power-up timing
td(pu)(TX)
delay between power-up
and DATAIN in
transmission mode
XTAL = 8.48 MHz;
C1 = C2 = 27 pF;
Rp = 2.2 MΩ; see Fig.10
−
−
1
1
−
−
µs
td(pu)(RX)
delay between power-up
and DATAOUT in reception C1 = C2 = 27 pF;
XTAL = 8.48 MHz;
µs
mode
Rp = 2.2 MΩ;
fRXIN = 132.5 kHz;
120 dBµV sine wave;
see Fig.11
Power-down timing
td(pd)(TX) delay between PD = 0 and fosc = 8.48 MHz;
−
−
10
−
−
µs
DATAIN in transmission
mode
see Fig.12
td(pd)(RX)
delay between PD = 0 and
DATAOUT in reception
mode
f
osc = 8.48 MHz;
500
µs
fRXIN = 132.5 kHz;
120 dBµV sine wave;
see Fig.13
tactive(min)
minimum active time with
T = 10 ms power-down
period in reception mode
fosc = 8.48 MHz;
fRXIN = 132.5 kHz;
120 dBµV sine wave;
see Fig.14
−
1
−
µs
MGK834
0
d
132.5 kHz
V
o(rms)
(dBV)
−100
6
5
10
10
f (Hz)
Resolution bandwidth = 9 kHz; top: 0 dBV (RMS) = 120 dBµV (RMS); marker at −5 dBV (RMS) = 115 dBµV (RMS);
the CISPR16 network provides an attenuation of 6 dB, so the signal amplitude is 121 dBµV (RMS).
Fig.3 Carrier spectrum.
1999 May 31
8
Philips Semiconductors
Product specification
Home automation modem
TDA5051A
1500 Hz
MBH664
−10
20 dB
dBV
(RMS)
−60
117.5
132.5
147.5
f (kHz)
Resolution bandwidth = 100 Hz; B−20dB = 3000 Hz (2 × 1500 Hz).
Fig.4 Shaped signal spectrum.
V
RXIN
modulated sine wave 122 dBµV amplitude
V
(I)
0
t
G
AGC
+30 dB
8.68 dB
AGC range
−6 dB
t
c(AGC)
MGK011
(AGC time constant)
Fig.5 AGC time constant definition (not to scale).
9
1999 May 31
Philips Semiconductors
Product specification
Home automation modem
TDA5051A
TIMING
Configuration for clock
OSC1
DGND
CLK
7
5
OUT
f
osc
MICRO-
CONTROLLER
TDA5051A
XTAL
GND
MGK835
For parameter description, see Table 1.
Fig.6 External clock.
C1
CLK
OSC2
OSC1
OUT
CLK
4
5
8
7
IN
1
/
f
osc
2
MICRO-
CONTROLLER
XTAL
C2
TDA5051A
R
p
DGND
GND
MGK836
For parameter description, see Table 1.
Fig.7 Typical configuration for on-chip clock circuit.
10
1999 May 31
Philips Semiconductors
Product specification
Home automation modem
TDA5051A
Table 1 Clock oscillator parameters
OSCILLATOR
FREQUENCY
fosc
CLOCK OUTPUT
FREQUENCY
1⁄2fosc
CARRIER FREQUENCY
EXTERNAL COMPONENTS
fcr
6.080 to 9.504 MHz
95 to 148.5 kHz
3.040 to 4.752 MHz
C1 = C2 = 27 to 47 pF;
Rp = 2.2 to 4.7 MΩ;
XTAL = standard quartz crystal
Table 2 Calculation of parameters depending on the clock frequency
SYMBOL
PARAMETER
oscillator frequency
CONDITIONS
UNIT
fosc
with on-chip oscillator: frequency of the crystal Hz
quartz; with external clock: frequency of the
signal applied at OSC1
fCLKOUT
fcr
clock output frequency
1⁄2fosc
1⁄64fosc
Hz
Hz
carrier frequency/digital filter tuning
frequency
tsu
set-up time of the shaped burst
s
s
s
23
1472
------------
fosc
or
or
------
fcr
th
hold time of the shaped burst
23
------
fcr
1472
------------
fosc
tW(DI)(min)
minimum pulse width of DATAIN signal
1
tsu
+
-----
f cr
tW(burst)(min) minimum burst time of VO(DC) signal
tW(DI)(min) + th
s
s
tc(AGC)
AGC time constant
2514
------------
fosc
tsu(demod)
demodulation set-up time
demodulation hold time
s
s
3200
(≈max.)
------------
fosc
th(demod)
3800
------------
fosc
(≈max.)
1999 May 31
11
Philips Semiconductors
Product specification
Home automation modem
TDA5051A
t
t
TX
W(burst)
W(burst)(min)
OUT
V
O(DC)
t
t
h
su
0
t
W(DI)(min)
t
W(DI)
(1)
DATA
IN
(2)
(3)
MGK837
(1) tW(DI) > tW(DI)(min)
.
1
(2) tW(DI)(min) = tsu + -----
fcr
(3)
tW(DI)(min) < tsu; wrong operation.
Fig.8 Relationship between DATAIN and TXOUT (see Table 3).
Table 3 Relationship between DATAIN and TXOUT
PD
DATAIN
TXOUT
high-impedance
1
0
0
X(1)
1
high-impedance (after th)
active with DC offset
0
Note
1. X = don’t care.
t
handbook, halfpage
t
W(burst)
t
su
h
100%
MGK010
Fig.9 Pulse shape characteristics.
12
1999 May 31
Philips Semiconductors
Product specification
Home automation modem
TDA5051A
Timing diagrams
90% V
DD
V
DD
NOT DEFINED
CLOCK STABLE
CLK
OUT
HIGH
DATA
IN
TX
OUT
t
MGK015
d(pu)(TX)
DATAIN is an edge-sensitive input and must be HIGH before starting a transmission.
Fig.10 Timing diagram during power-up in transmission mode.
90% V
DD
V
DD
NOT DEFINED
CLOCK STABLE
CLK
OUT
RX
IN
NOT DEFINED
HIGH
DATA
OUT
t
t
d(dem)(h)
d(pu)(RX)
MGK016
Fig.11 Timing diagram during power-up in reception mode.
13
1999 May 31
Philips Semiconductors
Product specification
Home automation modem
TDA5051A
PD
DATA
IN
TX
OUT
t
d(pd)(TX)
normal operation
wrong operation
TX
delayed by PD
OUT
MGK017
Fig.12 Power-down sequence in transmission mode.
PD
RX
IN
DATA
OUT
t
t
t
d(pd)(RX)
d(dem)(su)
d(pd)(RX)
MGK018
DATA delayed by PD
OUT
Fig.13 Power-down sequence in reception mode.
PD
RX
IN
DATA
OUT
t
active(min)
T
I
DD(RX)
I
DD
I
DD(PD)
0
MGK845
Fig.14 Power saving by dynamic control of power-down.
14
1999 May 31
Philips Semiconductors
Product specification
Home automation modem
TDA5051A
TEST INFORMATION
1 µF
TX
DATA
OUT
IN
1
2
10
14
pulse
generator
300 Hz
50%
TDA5051A
(to be tested)
10 nF
DATA
RX
OUT
IN
7
8
30 Ω
Y1
Y2
XTAL
f
osc
OSCILLOSCOPE
DATA
IN
TX
/RX
IN
OUT
DATA
OUT
t
t
d(dem)(su)
d(dem)(h)
MGK838
Fig.15 Test set-up for measuring demodulation delay.
15
1999 May 31
Philips Semiconductors
Product specification
Home automation modem
TDA5051A
coupling
network
CISPR16
network
(3)
(4)
10 µF
33 nF
TX
47 µH
OUT
OSC1
OSC2
10
7
8
250 nF
33 nF
47 µH
TDA5051A
AGND, DGND, APGND
50 µH
5 Ω
12, 5, 9
50 Ω
1
13, 3, 11
V
V
V
DATA
(2)
DDA, DDD, DDAP
IN
250 nF
(1)
+5 V
POWER
SUPPLY
50 µH
SPECTRUM
ANALYSER
50 Ω
5 Ω
MGK839
(1) Square wave TTL signal 300 Hz, duty factor = 50% for measuring signal bandwidth (see spectrum Fig.3).
(2) DATAIN = LOW for measuring total harmonic distortion (see spectrum Fig.3).
(3) Tuned for fcr = 132.5 kHz.
(4) The CISPR16 network provides a −6 dB attenuation.
Fig.16 Test set-up for measuring THD and bandwidth of the TXOUT signal.
16
1999 May 31
Philips Semiconductors
Product specification
Home automation modem
TDA5051A
TX
OUT
in
out
+
10
+
SPECTRUM
ANALYSER
50 Ω
COUPLING
NETWORK
(1)
TDA5051A
12, AGND, DGND, APGND
5,
9
1
7
8
OSC1
OSC2
DATA
IN
out
WHITE
NOISE
XTAL = 8.48 MHz
GENERATOR
OSC1
OSC2
7
8
RX
out
in
IN
14
COUPLING
NETWORK
(1)
TDA5051A
(to be tested)
PARAMETERS
600 BAUD
12,
5,
9
AGND, DGND, APGND
PSEUDO RANDOM SEQUENCE:
9
2 −1 BITS LONG
2
DATA
OUT
DATA
IN
RXD
V24/TTL
INTERFACE
V24 SERIAL DATA
ANALYSER
DATA
OUT
TXD
MGK840
(1) See Fig.16.
Fig.17 Test set-up for measuring Bit Error Rate (BER).
17
1999 May 31
Philips Semiconductors
Product specification
Home automation modem
TDA5051A
APPLICATION INFORMATION
250 V (AC)
max
T 630 mA
47 nF/X2
250 V (AC)
2 µF
250 V (AC)
MOV
250 V (AC)
68 Ω
(2 W)
47 µH
low R
S
47 nF
(63 V)
+5 V
1 mH
1N4006
1
3
78L05
2
7V5
(1.3 W)
1N4006
47 µH
470 µF
(16 V)
1 µF
(16 V)
100 µF
(16 V)
47 nF
V
V
V
DDA
DDD
DDAP
+5 V
DATA
3
11
13
IN
1
2
10 nF
RX
TX
IN
DATA
14
10
OUT
MICRO-
CONTROLLER
TDA5051A
OUT
CLK
OUT
PD
4
SA5.0A
15
7
8
5
9
12
OSC1
2.2 MΩ
OSC2 DGND APGND AGND
XTAL
7.3728 MHz
27 pF
27 pF
MGK841
fcr = 115.2 kHz for a XTAL = 7.3728 MHz standard crystal.
Fig.18 Application diagram without power line insulation.
18
1999 May 31
Philips Semiconductors
Product specification
Home automation modem
TDA5051A
MBH907
3
20
10
gain
(dB)
0
input
impedance
(Ω)
−
20
2
−
40
10
1
−
60
2
−
80
10
−
100
10
2
3
4
5
6
7
10
10
10
10
10
10
f (Hz)
Main features of the coupling network: 50 Hz rejection >80 dB; anti-aliasing for the digital filter >50 dB at the
sampling frequency (1⁄2fosc). Input impedance always higher than 10 Ω within the 95 to 148.5 kHz band.
Fig.19 Gain (curve 1) and input impedance (curve 2) of the coupling network (fcr = 115.2 kHz; L = 47 µH;
C = 47 nF).
MBH908
130
handbook, halfpage
V
o
(dBµV)
120
110
100
2
1
10
10
Z
(Ω)
line
Fig.20 Output voltage as a function of line impedance (with coupling network; L = 47 µH; C = 47 nF).
1999 May 31
19
Philips Semiconductors
Product specification
Home automation modem
TDA5051A
250 V (AC)
max
470 nF/X2
250 V (AC)
T 630 mA
100 Ω
(0.5 W)
MOV
250 V (AC)
47 µH
low R
S
NEWPORT
76250
230 V
6 V
2
1
6
5
1 VA
+5 V
100 Ω
1
3
78L05
FDB08
100 nF
(63 V)
22 µH
2
470 µF
(16 V)
100 µF
(16 V)
47 nF
1 µF
(16 V)
V
V
V
DDD
DDAP
DDA
+5 V
DATA
3
11
13
IN
1
2
10 nF
RX
TX
IN
DATA
14
10
OUT
MICRO-
CONTROLLER
TDA5051A
OUT
CLK
OUT
PD
4
15
7
8
5
9
12
SA5.0A
OSC1
2.2 MΩ
OSC2 DGND APGND AGND
XTAL
7.3728 MHz
27 pF
27 pF
MGK842
fcr = 115.2 kHz for a XTAL = 7.3728 MHz standard crystal.
Fig.21 Application diagram with power line insulation.
20
1999 May 31
Philips Semiconductors
Product specification
Home automation modem
TDA5051A
250 V (AC)
T 630 mA
max
2 µF
250 V (AC)
47 nF/X2
250 V (AC)
MOV
250 V (AC)
68 Ω
(2 W)
47 µH
low R
S
+5 V
1 mH
47 nF
(63 V)
1N4006
1
3
78L05
2
7V5
(1.3 W)
1N4006
470 µF
(16 V)
47 µH
100 µF
(16 V)
47 nF
1 µF
(16 V)
V
V
V
DDA
DDD
DDAP
10
kΩ
+5 V
DATA
3
11
13
IN
150
kΩ
1
2
10 nF
RX
TX
IN
DATA
14
10
OUT
10 nF
MICRO-
CONTROLLER
TDA5051A
BC547B
OUT
CLK
OUT
PD
4
33
kΩ
1 kΩ
15
7
8
5
9
12
OSC1
2.2 MΩ
OSC2 DGND APGND AGND
XTAL
7.3728 MHz
SA5.0A
27 pF
27 pF
MGK843
fcr = 115.2 kHz for a XTAL = 7.3728 MHz standard crystal.
Fig.22 Application diagram without power line insulation, with improved sensitivity (68 dBµV typ.).
1999 May 31
21
Philips Semiconductors
Product specification
Home automation modem
TDA5051A
250 V (AC)
max
470 nF/X2
250 V (AC)
T 630 mA
100 Ω
(0.5 W)
MOV
250 V (AC)
47 µH
low R
S
NEWPORT
76250
230 V
6 V
2
1
6
5
1 VA
+5 V
100 Ω
1
3
78L05
FDB08
100 nF
(63 V)
22 µH
2
470 µF
(16 V)
100 µF
(16 V)
47 nF
1 µF
(16 V)
V
V
V
DDD
DDAP
DDA
10
kΩ
+5 V
DATA
3
11
13
IN
150
kΩ
1
2
10 nF
RX
TX
IN
DATA
14
10
OUT
10 nF
MICRO-
CONTROLLER
TDA5051A
BC547B
OUT
CLK
OUT
PD
4
33
kΩ
1 kΩ
15
7
8
5
9
12
OSC1
2.2 MΩ
OSC2 DGND APGND AGND
XTAL
7.3728 MHz
SA5.0A
27 pF
27 pF
MGK844
fcr = 115.2 kHz for a XTAL = 7.3728 MHz standard crystal.
Fig.23 Application diagram with power line insulation, with improved sensitivity (68 dBµV typ.).
1999 May 31
22
Philips Semiconductors
Product specification
Home automation modem
TDA5051A
PACKAGE OUTLINE
SO16: plastic small outline package; 16 leads; body width 7.5 mm
SOT162-1
D
E
A
X
c
H
v
M
A
E
y
Z
16
9
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
8
detail X
e
w
M
b
p
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
max.
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
θ
1
2
3
p
E
p
Z
0.30
0.10
2.45
2.25
0.49
0.36
0.32
0.23
10.5
10.1
7.6
7.4
10.65
10.00
1.1
0.4
1.1
1.0
0.9
0.4
mm
2.65
1.27
0.050
1.4
0.25
0.01
0.25
0.1
0.25
0.01
8o
0o
0.012 0.096
0.004 0.089
0.019 0.013 0.41
0.014 0.009 0.40
0.30
0.29
0.419
0.394
0.043 0.043
0.016 0.039
0.035
0.016
inches 0.10
0.055
0.01 0.004
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
95-01-24
97-05-22
SOT162-1
075E03
MS-013AA
1999 May 31
23
Philips Semiconductors
Product specification
Home automation modem
TDA5051A
If wave soldering is used the following conditions must be
observed for optimal results:
SOLDERING
Introduction to soldering surface mount packages
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering is not always suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
downstream end.
Reflow soldering
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.
Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Wave soldering
Manual soldering
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
To overcome these problems the double-wave soldering
method was specifically developed.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
1999 May 31
24
Philips Semiconductors
Product specification
Home automation modem
TDA5051A
Suitability of surface mount IC packages for wave and reflow soldering methods
SOLDERING METHOD
PACKAGE
WAVE
REFLOW(1)
BGA, SQFP
not suitable
suitable
suitable
suitable
suitable
suitable
HLQFP, HSQFP, HSOP, HTSSOP, SMS not suitable(2)
PLCC(3), SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
suitable
not recommended(3)(4)
not recommended(5)
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1999 May 31
25
Philips Semiconductors
Product specification
Home automation modem
TDA5051A
NOTES
1999 May 31
26
Philips Semiconductors
Product specification
Home automation modem
TDA5051A
NOTES
1999 May 31
27
Philips Semiconductors – a worldwide company
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For all other countries apply to: Philips Semiconductors,
Internet: http://www.semiconductors.philips.com
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
© Philips Electronics N.V. 1999
SCA65
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
295002/25/02/pp28
Date of release: 1999 May 31
Document order number: 9397 750 05035
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