Philips Stereo Amplifier TDA7052A User Manual

INTEGRATED CIRCUITS  
DATA SHEET  
TDA7052A/AT  
1 W BTL mono audio amplifier with  
DC volume control  
July 1994  
Product specification  
File under Integrated circuits, IC01  
 
Philips Semiconductors  
Product specification  
1 W BTL mono audio amplifier with DC  
volume control  
TDA7052A/AT  
V
P
1
7
n.c.  
TDA7052A  
TDA7052AT  
I + i  
5
positive output  
2
4
positive input  
DC volume  
control  
I
– i  
8
negative output  
STABILIZER TEMPERATURE  
PROTECTION  
V
ref  
3
6
MCD385 - 1  
signal  
ground  
power  
ground  
Fig.1 Block diagram.  
PINNING  
SYMBOL  
PIN  
DESCRIPTION  
handbook, halfpage  
V
VP  
1
2
3
4
5
6
7
8
positive supply voltage  
positive input  
1
2
8
OUT –  
n.c.  
P
IN+  
IN +  
7
6
5
TDA7052A  
TDA7052AT  
GND1  
VC  
signal ground  
GND1  
VC  
3
4
GND2  
OUT +  
DC volume control  
positive output  
power ground  
OUT+  
GND2  
n.c  
MCD384  
not connected  
Fig.2 Pin configuration.  
OUT−  
negative output  
July 1994  
3
 
Philips Semiconductors  
Product specification  
1 W BTL mono audio amplifier with DC  
volume control  
TDA7052A/AT  
Thus a reduced power supply with smaller capacitors can  
be used which results in cost savings.  
FUNCTIONAL DESCRIPTION  
The TDA7052A/AT are mono BTL output amplifiers with  
DC volume control, designed for use in TV and monitors  
but also suitable for battery fed portable recorders and  
radios.  
For portable applications there is a trend to decrease the  
supply voltage, resulting in a reduction of output power at  
conventional output stages. Using the BTL principle  
increases the output power.  
In conventional DC volume circuits the control or input  
stage is AC coupled to the output stage via external  
capacitors to keep the offset voltage low.  
The maximum gain of the amplifier is fixed at 35.5 dB. The  
DC volume control stage has a logarithmic control  
characteristic.  
In the TDA7052A/AT the DC volume control stage is  
integrated into the input stage so that no coupling  
capacitors are required and yet a low offset voltage is  
maintained. At the same time the minimum supply remains  
low.  
The total gain can be controlled from 35.5 dB to 44 dB. If  
the DC volume control voltage is below 0.3 V, the device  
switches to the mute mode.  
The amplifier is short-circuit proof to ground, VP and  
across the load. Also a thermal protection circuit is  
implemented. If the crystal temperature rises above  
+150 °C the gain will be reduced, so the output power is  
reduced.  
The BTL principle offers the following advantages:  
Lower peak value of the supply current  
The frequency of the ripple on the supply voltage is twice  
the signal frequency.  
Special attention is given to switch on and off clicks, low  
HF radiation and a good overall stability.  
LIMITING VALUES  
In accordance with the Absolute Maximum System (IEC 134)  
SYMBOL  
VP  
PARAMETER  
supply voltage range  
CONDITIONS  
MIN.  
MAX.  
18  
UNIT  
V
A
A
IORM  
IOSM  
Ptot  
repetitive peak output current  
non-repetitive peak output current  
total power dissipation  
TDA7052A  
1.25  
1.5  
Tamb 25%  
1.25  
0.8  
+85  
+150  
+150  
1
W
W
°C  
°C  
°C  
hr  
V
TDA7052AT  
Tamb  
Tstg  
Tvj  
operating ambient temperature range  
storage temperature range  
virtual junction temperature  
short-circuit time  
40  
55  
Tsc  
V2  
input voltage pin 2  
8
V4  
input voltage pin 4  
8
V
July 1994  
4
 
Philips Semiconductors  
Product specification  
1 W BTL mono audio amplifier with DC  
volume control  
TDA7052A/AT  
THERMAL RESISTANCE  
SYMBOL  
PARAMETER  
THERMAL RESISTANCE  
Rth j-a  
from junction to ambient in free air  
TDA7052A  
100 K/W  
155 K/W  
TDA7052AT  
Notes to the thermal resistance  
TDA7052A: VP = 6 V; RL = 8 . The maximum sine-wave dissipation is 0.9 W.  
Therefore Tamb(max) = 150 100 × 0.9 = 60 °C.  
TDA7052AT: VP = 6 V; RL = 16 . The maximum sine-wave dissipation is 0.46 W.  
Therefore Tamb(max) = 150 155 × 0.46 = 78 °C.  
July 1994  
5
 
Philips Semiconductors  
Product specification  
1 W BTL mono audio amplifier with DC  
volume control  
TDA7052A/AT  
CHARACTERISTICS  
VP = 6 V; Tamb = 25 °C; f = 1 kHz; TDA7052A: RL = 8 ; TDA7052AT: RL = 16 ; unless otherwise specified (see Fig.6).  
SYMBOL  
VP  
IP  
PARAMETER  
CONDITIONS  
MIN.  
TYP.  
MAX. UNIT  
positive supply voltage range  
total quiescent current  
4.5  
7
18  
12  
V
VP = 6 V; RL = ∞  
mA  
note 1  
Maximum gain; V4 = 1.4 V  
PO  
output power  
THD = 10%  
TDA7052A  
1.0  
0.5  
1.1  
W
W
TDA7052AT  
0.55  
THD  
total harmonic distortion  
TDA7052A  
PO = 0.5 W  
0.3  
0.3  
1
1
%
%
TDA7052AT  
PO = 0.25 W  
Gv  
voltage gain  
34.5 35.5  
36.5 dB  
VI  
input signal handling  
noise output voltage (RMS value)  
bandwidth  
V4 = 0.8 V; THD < 1%  
f = 500 kHz; note 2  
1 dB  
0.5  
0.65  
210  
V
Vno(rms)  
B
µV  
20 Hz to  
300 kHz  
SVRR  
|Voff|  
ZI  
supply voltage ripple rejection  
DC output offset voltage  
input impedance (pin 2)  
note 3  
38  
46  
0
150  
25  
dB  
mV  
kΩ  
15  
20  
Minimum gain; V4 = 0.5 V  
Gv  
voltage gain  
44  
20  
30  
dB  
Vno(rms)  
noise output voltage (RMS value)  
note 4  
µV  
Mute position  
VO  
output voltage in mute position  
V4 0.3 V; VI = 600 mV  
30  
µV  
DC volume control  
φ
I4  
gain control range  
control current  
75  
60  
80  
70  
80  
dB  
V4 = 0.4 V  
µA  
Notes to the characteristics  
1. With a load connected to the outputs the quiescent current will increase, the maximum value of this increase being  
equal to the DC output offset voltage dividend by RL.  
2. The noise output voltage (RMS value) at f = 500 kHz is measured with RS = 0 and bandwidth = 5 kHz.  
3. The ripple rejection is measured with RS = 0 and f = 100 Hz to 10 kHz. The ripple voltage of 200 mV, (RMS value)  
is applied to the positive supply rail.  
4. The noise output voltage (RMS value) is measured with RS = 5 kunweighted.  
July 1994  
6
 
Philips Semiconductors  
Product specification  
1 W BTL mono audio amplifier with DC  
volume control  
TDA7052A/AT  
MCD389 - 1  
MCD388  
1000  
40  
gain  
(dB)  
handbook, halfpage  
handbook, halfpage  
V
noise  
(µV)  
20  
0
800  
600  
400  
200  
– 20  
– 40  
– 60  
– 80  
0
0
0.4  
0.8  
1.2  
1.6  
2.0  
0
0.4  
0.8  
1.2  
1.6  
2.0  
(V)  
V
V
(V)  
4
4
Fig.4 Noise output voltage as a function of DC  
volume control.  
Fig.3 Gain control as a function of DC volume control.  
MCD390 - 1  
100  
handbook, halfpage  
I
4
(µA)  
60  
20  
– 20  
– 60  
– 100  
0
0.4  
0.8  
1.2  
1.6  
2.0  
(V)  
V
4
Fig.5 Control current as a function of DC volume  
control.  
July 1994  
7
 
Philips Semiconductors  
Product specification  
1 W BTL mono audio amplifier with DC  
volume control  
TDA7052A/AT  
APPLICATION INFORMATION  
(1)  
V
= 6 V  
P
100 nF  
220 µF  
1
7
n.c.  
TDA7052A  
TDA7052AT  
I + i  
5
positive  
input  
0.47 µF  
2
R
R
= 8 Ω  
L
4
(TDA7052A)  
= 16 Ω  
L
(TDA7052A/AT)  
I – i  
8
R
5 kΩ  
S
STABILIZER  
TEMPERATURE  
PROTECTION  
V
ref  
DC  
volume  
control  
3
6
MCD386 - 1  
This capacitor can be omitted if the 220 µF electrolytic capacitor is connected close to pin 1.  
ground  
Fig.6 Test and application diagram.  
handbook, halfpage  
volume  
control  
4
1 µF  
1 MΩ  
MCD387  
Fig.7 Application with potentiometer as volume  
control; maximum gain = 30 dB.  
July 1994  
8
 
Philips Semiconductors  
Product specification  
1 W BTL mono audio amplifier with DC  
volume control  
TDA7052A/AT  
PACKAGE OUTLINES  
DIP8: plastic dual in-line package; 8 leads (300 mil)  
SOT97-1  
D
M
E
A
2
A
A
1
L
c
w M  
Z
b
1
e
(e )  
1
M
H
b
b
2
8
5
pin 1 index  
E
1
4
0
5
10 mm  
scale  
DIMENSIONS (inch dimensions are derived from the original mm dimensions)  
(1)  
Z
A
A
A
(1)  
(1)  
1
2
w
UNIT  
mm  
b
b
b
c
D
E
e
e
L
M
M
H
1
2
1
E
max.  
min.  
max.  
max.  
1.73  
1.14  
0.53  
0.38  
1.07  
0.89  
0.36  
0.23  
9.8  
9.2  
6.48  
6.20  
3.60  
3.05  
8.25  
7.80  
10.0  
8.3  
4.2  
0.51  
3.2  
2.54  
0.10  
7.62  
0.30  
0.254  
0.01  
1.15  
0.068 0.021 0.042 0.014  
0.045 0.015 0.035 0.009  
0.39  
0.36  
0.26  
0.24  
0.14  
0.12  
0.32  
0.31  
0.39  
0.33  
inches  
0.17  
0.020  
0.13  
0.045  
Note  
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
EIAJ  
92-11-17  
95-02-04  
SOT97-1  
050G01  
MO-001AN  
July 1994  
9
 
Philips Semiconductors  
Product specification  
1 W BTL mono audio amplifier with DC  
volume control  
TDA7052A/AT  
SO8: plastic small outline package; 8 leads; body width 3.9 mm  
SOT96-1  
D
E
A
X
c
y
H
v
M
A
E
Z
5
8
Q
A
2
A
(A )  
3
A
1
pin 1 index  
θ
L
p
L
1
4
e
w
M
detail X  
b
p
0
2.5  
5 mm  
scale  
DIMENSIONS (inch dimensions are derived from the original mm dimensions)  
A
(1)  
(1)  
(2)  
UNIT  
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.  
0.25  
0.10  
1.45  
1.25  
0.49  
0.36  
0.25  
0.19  
5.0  
4.8  
4.0  
3.8  
6.2  
5.8  
1.0  
0.4  
0.7  
0.6  
0.7  
0.3  
mm  
1.27  
0.050  
1.05  
0.041  
1.75  
0.25  
0.01  
0.25  
0.01  
0.25  
0.1  
8o  
0o  
0.010 0.057  
0.004 0.049  
0.019 0.0100 0.20  
0.014 0.0075 0.19  
0.16  
0.15  
0.244  
0.228  
0.039 0.028  
0.016 0.024  
0.028  
0.012  
inches 0.069  
0.01 0.004  
Notes  
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.  
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
EIAJ  
95-02-04  
97-05-22  
SOT96-1  
076E03S  
MS-012AA  
July 1994  
10  
 
Philips Semiconductors  
Product specification  
1 W BTL mono audio amplifier with DC  
volume control  
TDA7052A/AT  
Several techniques exist for reflowing; for example,  
SOLDERING  
Introduction  
thermal conduction by heated belt. Dwell times vary  
between 50 and 300 seconds depending on heating  
method. Typical reflow temperatures range from  
215 to 250 °C.  
There is no soldering method that is ideal for all IC  
packages. Wave soldering is often preferred when  
through-hole and surface mounted components are mixed  
on one printed-circuit board. However, wave soldering is  
not always suitable for surface mounted ICs, or for  
printed-circuits with high population densities. In these  
situations reflow soldering is often used.  
Preheating is necessary to dry the paste and evaporate  
the binding agent. Preheating duration: 45 minutes at  
45 °C.  
WAVE SOLDERING  
This text gives a very brief insight to a complex technology.  
A more in-depth account of soldering ICs can be found in  
our “IC Package Databook” (order code 9398 652 90011).  
Wave soldering techniques can be used for all SO  
packages if the following conditions are observed:  
A double-wave (a turbulent wave with high upward  
pressure followed by a smooth laminar wave) soldering  
technique should be used.  
DIP  
SOLDERING BY DIPPING OR BY WAVE  
The longitudinal axis of the package footprint must be  
parallel to the solder flow.  
The maximum permissible temperature of the solder is  
260 °C; solder at this temperature must not be in contact  
with the joint for more than 5 seconds. The total contact  
time of successive solder waves must not exceed  
5 seconds.  
The package footprint must incorporate solder thieves at  
the downstream end.  
During placement and before soldering, the package must  
be fixed with a droplet of adhesive. The adhesive can be  
applied by screen printing, pin transfer or syringe  
dispensing. The package can be soldered after the  
adhesive is cured.  
The device may be mounted up to the seating plane, but  
the temperature of the plastic body must not exceed the  
specified maximum storage temperature (Tstg max). If the  
printed-circuit board has been pre-heated, forced cooling  
may be necessary immediately after soldering to keep the  
temperature within the permissible limit.  
Maximum permissible solder temperature is 260 °C, and  
maximum duration of package immersion in solder is  
10 seconds, if cooled to less than 150 °C within  
6 seconds. Typical dwell time is 4 seconds at 250 °C.  
REPAIRING SOLDERED JOINTS  
A mildly-activated flux will eliminate the need for removal  
of corrosive residues in most applications.  
Apply a low voltage soldering iron (less than 24 V) to the  
lead(s) of the package, below the seating plane or not  
more than 2 mm above it. If the temperature of the  
soldering iron bit is less than 300 °C it may remain in  
contact for up to 10 seconds. If the bit temperature is  
between 300 and 400 °C, contact may be up to 5 seconds.  
REPAIRING SOLDERED JOINTS  
Fix the component by first soldering two diagonally-  
opposite end leads. Use only a low voltage soldering iron  
(less than 24 V) applied to the flat part of the lead. Contact  
time must be limited to 10 seconds at up to 300 °C. When  
using a dedicated tool, all other leads can be soldered in  
one operation within 2 to 5 seconds between  
270 and 320 °C.  
SO  
REFLOW SOLDERING  
Reflow soldering techniques are suitable for all SO  
packages.  
Reflow soldering requires solder paste (a suspension of  
fine solder particles, flux and binding agent) to be applied  
to the printed-circuit board by screen printing, stencilling or  
pressure-syringe dispensing before package placement.  
July 1994  
11  
 
Philips Semiconductors  
Product specification  
1 W BTL mono audio amplifier with DC  
volume control  
TDA7052A/AT  
DEFINITIONS  
Data sheet status  
Objective specification  
Preliminary specification  
Product specification  
This data sheet contains target or goal specifications for product development.  
This data sheet contains preliminary data; supplementary data may be published later.  
This data sheet contains final product specifications.  
Limiting values  
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or  
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation  
of the device at these or at any other conditions above those given in the Characteristics sections of the specification  
is not implied. Exposure to limiting values for extended periods may affect device reliability.  
Application information  
Where application information is given, it is advisory and does not form part of the specification.  
LIFE SUPPORT APPLICATIONS  
These products are not designed for use in life support appliances, devices, or systems where malfunction of these  
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for  
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such  
improper use or sale.  
July 1994  
12  
 

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